Description
This specification covers a high-temperature, electrical-grade, polyimide resin adhesive in the form of film or paste. This product has been used typically as an adhesive for bonding polyimide-laminate-faced sandwich structures in radar-transparent assemblies, but usage is not limited to such applications. The adhesive is useful over the temperature range -55 degrees to +315 degrees C (-67 degrees to +600 degrees )F.
Product Details
- Published:
- 01/20/2022
- File Size:
- 1 file , 130 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
