Description
This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.
Product Details
- Published:
- 10/03/2011
- File Size:
- 1 file , 76 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
