Description
Specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
Product Details
- Edition:
- 1.0
- Published:
- 08/29/2006
- Number of Pages:
- 12
- File Size:
- 1 file , 260 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
