IEC 61249-8-8 Ed. 1.0 b:1997

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Materials for interconnection structures – Part 8: Sectional specification set for non-conductive films and coatings – Section 8: Temporary polymer coatings
standard by International Electrotechnical Commission, 06/24/1997

Document Format: PDF

Description

Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Product Details

Edition:
1.0
Published:
06/24/1997
Number of Pages:
19
File Size:
1 file , 120 KB
Note:
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