Description
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Product Details
- Edition:
- 1.0
- Published:
- 08/28/1998
- Number of Pages:
- 31
- File Size:
- 1 file , 530 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
