IEC 61189-1 Ed. 1.1 b:2001

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Test methods for electrical materials, interconnection structures and assemblies – Part 1: General test methods and methodology CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/22/2001

Document Format: PDF

Description

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

Product Details

Edition:
1.1
Published:
11/22/2001
Number of Pages:
51
File Size:
1 file , 620 KB
Note:
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