IEC 60749-22 Ed. 1.0 b:2002

$114.00

Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
standard by International Electrotechnical Commission, 09/12/2002

Document Format: PDF

Description

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Product Details

Edition:
1.0
Published:
09/12/2002
Number of Pages:
41
File Size:
1 file , 720 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus