IEC 60512-6-2 Ed. 1.0 b:2002

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Connectors for electronic equipment – Tests and measurements – Part 6-2: Dynamic stress tests – Test 6b: Bump
standard by International Electrotechnical Commission, 02/21/2002

Document Format: PDF

Description

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.

Product Details

Edition:
1.0
Published:
02/21/2002
Number of Pages:
9
File Size:
1 file , 400 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus