IEC 60191-6-3 Ed. 1.0 b:2000

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Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
standard by International Electrotechnical Commission, 09/29/2000

Document Format: PDF

Description

Description

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

Product Details

Edition:: 1.0
Published:: 09/29/2000
Number of Pages:: 34
File Size:: 1 file , 320 KB
Note:: This product is unavailable in Ukraine, Russia, Belarus

Documents History

IEC 60191-6-3 Ed. 1.0 en:2000
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