IEC 60191-6-12 Ed. 1.0 en:2002

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Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch land grid array (FLGA) – Rectangular type
standard by International Electrotechnical Commission, 06/14/2002

Document Format: PDF

Description

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Product Details

Edition:
1.0
Published:
06/14/2002
Number of Pages:
20
File Size:
1 file , 490 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus