BS 3934-5:1992

$151.00

Mechanical standardization of semiconductor devices-Recommendations for tape automated bonding (TAB) of integrated circuits
standard by BSI Group, 04/01/1992

Document Format: PDF

Description

Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or ‘chip carriers’.

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:
04/01/1992
ISBN(s):
058020250X, 058020250
Number of Pages:
16
File Size:
1 file
Product Code(s):
261416, 261416, 261416
Note:
This product is unavailable in Ukraine, Russia, Belarus