Description
1.1 This test method covers a simple qualitative procedure for quickly screening whether an adhesive will, under recommended application conditions, bond to a given substrate without actually making bonded assemblies.
1.2 The values stated in SI units are to be regarded as the standard. The values in parentheses are for information only.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Product Details
- Published:
- 10/10/2001
- Number of Pages:
- 2
- File Size:
- 1 file , 21 KB
- Redline File Size:
- 2 files , 36 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
