Description
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures and minimally-packaged semiconductor die. Specifies requirements of operational thermal conditions of unpackaged and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in it’s use.
Cross References:
IEC 60050
EN/IEC 60068-2
IEC 60617-1
IEC 60617-12
IEC 60617-13
SEMI G42-0996
SEMI G68-0996
SEMI G43-87
SEMI G32-94
EIA/JESD5
EIA/JESD10
EIA/JESD24
EIA/JESD41
EIA/JESD45
EIA/JESD51-4
EIA-531
JEP110
EIA/JESD51-1
MIL-STD-883
MIL-STD-750D
ISO 9000
ES 59008-1
ES 59008-2
ES 59008-3
Replaced by BS EN 62258-6:2006 but remains current.
All current amendments available at time of purchase are included with the purchase of this document.
Product Details
- Published:
- 03/15/2000
- ISBN(s):
- 0580341844
- Number of Pages:
- 12
- File Size:
- 1 file , 610 KB
- Product Code(s):
- 19978913, 19978913, 19978913
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
