Description
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Product Details
- Edition:
- 1.0
- Published:
- 12/17/2002
- Number of Pages:
- 93
- File Size:
- 1 file , 7.3 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
