ASTM F641-09(2023)

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Standard Specification for Implantable Epoxy Electronic Encapsulants
standard by ASTM International, 01/01/2023

Document Format: PDF

Description

1.1 This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts.

Product Details

Published:
01/01/2023
Number of Pages:
4
File Size:
1 file , 94 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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